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Brand Name : LEFANG
Model Number : RM0002L167
Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Place of Origin : Shenzhen,China
MOQ : 1 Piece
Price : Negotiable
Payment Terms : T/T, Western Union, Paypal
Supply Ability : 290, 000sqm Per Month
Delivery Time : 2-10 work days
Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing
Base Material/ Dielectric : FR - 4
Layer : 2 Layers
surface treatment : OSP
Copper Thickness : 1 OZ
Solder Mask : Blue
Min. Aperture : 0.3 mm
Line Width/Spacing : 0.1 / 0.1mm
Size : 192 *28 mm
Board thickness : 1.6 Mm
Touchpad PCB Printed Circuit Board Manufacturer
         How to get quick quotation?
 
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
| Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others | ||||||||||||||||||||
| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
|   us for clone. | ||||||||||||||||||||
|        SAMPLE: | ||||||||||||||||||||
| 
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-- We employ 70 professional engineers to ensure our high quality products.
 
| Department | Headcount | 
| Electronic Eng. | 13 | 
| R&D Eng. | 15 | 
| PE Eng. | 10 | 
| CAM Eng. | 26 | 
| MI Eng. | 6 | 
Now send us your inquiry, and you will be replied within 8 hours!
Consideration about PCB fabrication
When placed an order of PCBs (printed circuit boards), you should spend time to considerate the basic factors including PCB board substrate material, layer count, board size, board thickness, copper thickness, surface finish, solder mask, silkscreen, blind vias, buried vias, through-hole plating, SMT and so on. When all the factors are checked and confirmed with the engineers, we highly recommended sample tested before the real fabrication of your PCB boards. If all things go well, fabrication could be started right away. However, it may need to do some modification if customer is not satisfied with the sample.
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