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Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

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Shenzhen Lefang Electronics Co., Ltd

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Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

Name: Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask
Brand: LEFANG
Price: 1 USD

China Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask wholesale

Brand Name : LEFANG

Model Number : RM0004L145

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1 Piece

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal, MoneyGram

Supply Ability : 290, 000 sqm Per Month

Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing

Delivery Time : 2-10 work days

Raw material : Fr - 4

Layer count : 4 Layer

Board thickness : 1.6 mm

Copper thickness : 1 Oz / 35 µm

Surface treatment : OSP

Solder mask : Green

Board size2104 * 105 mm4.56 * 58.83 mm : 65 * 40 mm

Min. Aperture : 0.1 mm

Line Trace Width/Space : 0.13 / 0.13 mm

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Multilayer RoHS Power Board Circuit Board PCB for Electronics Communication Main Board

The layer count multilayer PCB is 4 layers. THe board thickness is 1.6mm. And the size of this pcb board is 65 * 40 mm with white solder mask and OSP surface treatment. The min.Line Trace Width/Space are 0.13 / 0.13 mm.

Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask

Why choose LEFANG?

-- Lefang provides One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered

Free Sample - Sample for free before mass production

Quality Control - Sales Team monitors the production quality and lead time

On Time Delivery - Customize the logistics plan according to customer’s requirement

After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc

Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)

Material Specification:High Tg / copper based / aluminum based or others (optional)

Board thickness: 0.1 - 6.0 mm

Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )

Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin

Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc

Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE
Board material	Fr - 4
Material brand	KB
Material Specification	Tg 170
Board thickness	1.6 mm
Copper thickness	1 Oz
Surface Treatment	ENIG
Solder mask / sSilk print	Green / White
Board size	100 mm * 100 mm
Quantity	10k

Lead Time

Layer count	Sample lead time/workday	Batch lead time/workday
1-2L	2	6
4L	5	8
6L	5	9
8L	6	10
10L	8	10
12L	8	12
14L	10	15
16L	10	18
18-40L (Up to difficulty)	at least 18	at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

What kinds of quality Raw Materials will be used?

Board Brand	ITEQ, SY, Isola. Rogers, Arlon, Nelco, Taconic, Hitachi, KB,etc
Potion	Rohm & Haas, Atotech, Umicore
Printing Ink	Taiyo, Rongda
Dry Film	Asahi, Dupont, Etertec

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

Product Tags:

blind via pcb

pcb power board

Multilayer RoHS Communication PCB Circuit Board With Green Solder Mask Images

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